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5.2.1.1.(3)
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Application
Application 1: 
Soil temperature analysis for building components and assemblies, and interfaces between components and assemblies, that separate interior space from the ground.
This applies to buildings described in Sentence 1.3.3.2.(1) of Division A, where local design and construction practice has shown soil temperature analysis to be unnecessary.
Application 2: 
This also applies to the position of low air and vapour permeance materials within the building assembly relative to the position of materials providing thermal resistance in the assemblies of buildings to which Part 9 applies [see Sentence 1.3.3.3.(1) of Division A for application of Part 9], where the building assembly:
  • incorporates low permeance materials that act as other than cladding or that are installed on the warm side of the assembly, and
  • is more susceptible to condensation [see Sentences 9.25.1.2.(4) and (5) for combinations of interior and exterior environmental conditions that create a higher risk for condensation].
Application 3: 
This also applies to the design of vapour barriers in buildings to which Part 9 applies [see Sentence 1.3.3.3.(1) of Division A for application of Part 9], where the building assembly is more susceptible to condensation [see Sentences 9.25.4.2.(2) and (3) for combinations of interior and exterior environmental conditions that create a higher risk for condensation].
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Intent
Intent 1: 
To exempt buildings from analysis of soil temperature, if they are designed and constructed according to local practice which has been demonstrated to be effective in minimizing condensation within and on the interior surfaces of assemblies in contact with the ground and, in conjunction with mechanical systems installed for space conditioning, in meeting the interior design thermal conditions.
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